UP scientists hope to lower terahertz cost with new semiconductor design

Scientists from the University of the Philippines Diliman have developed a new semiconductor design that could lower the cost of terahertz (THz) technology, which is being used for various purposes, from medical imaging to high-speed wireless communication. 

The new design for semiconductor components for terahertz technology was introduced by Cyril Salang, Arnel Salvador, Armando Somintac, and Elmer Estacio from UPD-College of Science and Joselito Muldera of RIKEN—a national scientific research institute in Japan. Their design features a substrate, a buffer layer, and an epitaxial layer—a thin crystal layer grown on top. 

“What makes their design unique is the use of a mismatched buffer layer—a material whose atomic structure (called lattice constant) differs significantly from both the substrate below and the epitaxial layer above,” the statement from UPD-CS read.

“While such mismatches typically lead to defects or poor performance, the scientists’ invention surprisingly results in high-quality layers that perform just as well as, or even better than, traditional materials used in THz emitters.” 

“Its performance was comparable to traditional bulk materials when using a 0.80 μm laser and even better with a 1.55 μm fiber laser—which is cheaper and more practical for mainstream use—making this invention a potential game-changer for THz-TDS systems,” the statement added. 

Salang said their patent application was granted last year.

“Receiving a national patent means that the originality of our work is recognized. It encourages me to do further innovation,” she said.

Aside from medical imaging, terahertz technology is also present in security screening, product inspection, and space communication. —VBL, GMA Integrated News